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Influence of hole size in static strength and fatigue for CFRP composite materials Conference paper
Proceedings of the International Conference on Advanced Composite Materials
Authors:  Yip Ming-Chuen;  Perng Tzay-Biau
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Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging application Conference paper
Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.;  Jen Y.-M.
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Time and temperature dependent mechanical characterization of polyimide materials in electronic packaging application Conference paper
Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.
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Mechanical characterization of board-level 63Sn37Pb and lead-free solder sphere attachment on Cu-pad/Ni/Au surface finish substrate Conference paper
Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003
Authors:  Fan J.-W.;  Kuo C.-T.;  Yip M.-C.
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Characterization of time and temperature dependent mechanical behavior of underfill materials in electronic packaging application Conference paper
Advances in Electronic Packaging
Authors:  Kuo C.-T.;  Yip M.-C.;  Chiang K.-N.
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Creep  Strain rate  Thermo-mechanical testing  Underfill films  
Mechanical and electrical properties of MWNT/phenolic composites under moisture-temperature effects Conference paper
Key Engineering Materials
Authors:  Yip M.-C.;  Chien T.-C.;  Wang K.-S.
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Carbon nanotube  Electrical property  Tensile strength  Thermal cycle  
Fatigue and electrical properties of CNT/phenolic composites under moisture-temperature effects Conference paper
Key Engineering Materials
Authors:  Yip M.-C.;  Wu H.-Y.
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Carbon nanotube  Composite materials  Fatigue  Thermal cycling  
Decoupled Z-axis microgyroscope using oblique comb for frequency tuning Conference paper
Proceedings of IEEE Sensors
Authors:  Hsu C.-P.;  Tsai D.-H.;  Yip M.-C.;  Fang W.
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Bending and reliability test of chip-on-flex (COF) assembly using anisotropic conductive films (ACFs) Conference paper
Proceedings of the Electronic Packaging Technology Conference, EPTC
Authors:  Yip M.-C.;  Huang C.-Y.;  Chen C.-L.;  Lu S.-T.
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The two-axis magnetostatic-drive single-crystal-si micro scanner driven by back-side electroplating Ni film Conference paper
2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS
Authors:  Hsu C.-P.;  Chen W.-C.;  Tang T.-L.;  Yip M.-C.;  Fang W.
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Mechanical properties of PDMS/CNTs nanocomposites Conference paper
Materials Research Society Symposium Proceedings
Authors:  Wu C.-L.;  Lin H.-C.;  Huang C.-H.;  Yip M.-C.;  Fang W.
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PDMS/CNTs (polydimethylsiloxane and carbon nanotubes)  
Preparation and characterization of carbon nanotubes / epoxy resin nano-prepreg for nanocomposites Conference paper
Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008
Authors:  Li Y.-L.;  Chen W.-J.;  Wang K.-S.;  Yip M.-C.
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Carbon Nanotube  Electrical Conductivity  Nano-prepreg  
Mechanical and physical properties of polydimethylsiloxane/multi-walled carbon nanotube nanocomposites Conference paper
Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008
Authors:  Wu C.-L.;  Lin H.-C.;  Yip M.-C.;  Fang W.
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Initial modulus  Multi-walled carbon nanotube (MWNT)  Nanocomposites  Polydimethylsiloxane (PDMS)  Storage modulus  
Mechanical and electrical properties of phenolic resin/molybdenum hexacarbonyl carbon/carbon composite for fuel cell bipolar plate Conference paper
Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008
Authors:  Tseng S.-H.;  Chen W.-J.;  Li Y.-L.;  Yip M.-C.
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Bipolar Plate  Bulk Molding Compound (BMC)  Molybdenum Hexacrbonyl Precursor  
Synthesis of carbon nanotubes in a vertical tube furnace and their applications in electromagnetic interference shielding Conference paper
24th Annual Technical Conference of the American Society for Composites 2009 and 1st Joint Canadian-American Technical Conference on Composites
Authors:  Tai N.-H.;  Chen H.M.;  Chen Y.-J.;  Sun C.-K.;  Yip M.-C.;  Huang C.-Y.
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Study on the electrical and thermal properties of carbon/carbon composite for fuel cell bipolar plate Conference paper
ICCM International Conferences on Composite Materials
Authors:  Chen W.-J.;  Tseng S.-H.;  Li Y.-L.;  Yip M.-C.
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Bulk Molding Compound (BMC)  Electrical Conductivity  Fuel Cell Bipolar Plate  Molybdenum Hexacrbonyl Precursor  Thermal conductivity  
A novel SOI Z-axis accelerometer with gap closing differential sensing electrodes Conference paper
TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Authors:  Hsu C.-P.;  Yip M.-C.;  Fang W.
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Accelerometer  Gap closing  SOI  
Thermal and mechanical properties of carbon aerogels for nanocomposites Conference paper
7th Asian-Australasian Conference on Composite Materials 2010, ACCM 2010
Authors:  Chen W.-J.;  Shen M.-Y.;  Li Y.-L.;  Su H.-S.;  Li J.-Y.;  Chou C.-C.;  Yip M.-C.
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Carbon aerogels  Interlaminar shear strength  Nanocomposites  
Mechanical and physical properties of PET/nylon base wood-plastic composites Conference paper
7th Asian-Australasian Conference on Composite Materials 2010, ACCM 2010
Authors:  Shen M.-Y.;  Li J.-Y.;  Chen W.-J.;  Li Y.-L.;  Sung M.-H.;  Hsiao Y.-K.;  Yip M.-C.
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Coupling agent  Mechanical properties  Thermal aging and humidity  Wood-plastic composites (WPCs)  
Thermal properties of carbon aerogel reinforced epoxy nanocomposites Conference paper
7th Asian-Australasian Conference on Composite Materials 2010, ACCM 2010
Authors:  Shen M.-Y.;  Chen W.-J.;  Li Y.-L.;  Huang C.-W.;  Sung M.-H.;  Hsiao Y.-K.;  Yip M.-C.
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Carbon aerogel  Degradation temperature  Epoxy nanocomposite  Glass transition temperature  Thermal expansion coefficient