UM  > Faculty of Science and Technology
Affiliated with RCfalse
Trending IC design directions in 2022
Chan, Chi Hang1; Cheng, Lin2; Deng, Wei3; Feng, Peng4; Geng, Li5; Huang, Mo1; Jia, Haikun3; Jie, Lu3; Lei, Ka Meng1; Liu, Xihao5; Liu, Xun6; Liu, Yongpan3; Lu, Yan1; Nie, Kaiming7; Pan, Dongfang2; Qi, Nan4; Sin, Sai Weng1; Sun, Nan3; Sun, Wenyu3; Xu, Jiangtao7; Yue, Jinshan3; Zhang, Milin3; Zhang, Zhao4
Source PublicationJournal of Semiconductors

For the non-stop demands for a better and smarter society, the number of electronic devices keeps increasing exponentially; and the computation power, communication data rate, smart sensing capability and intelligence are always not enough. Hardware supports software, while the integrated circuit (IC) is the core of hardware. In this long review paper, we summarize and discuss recent trending IC design directions and challenges, and try to give the readers big/cool pictures on each selected small/hot topics. We divide the trends into the following six categories, namely, 1) machine learning and artificial intelligence (AI) chips, 2) communication ICs, 3) data converters, 4) power converters, 5) imagers and range sensors, 6) emerging directions. Hope you find this paper useful for your future research and works.

KeywordArtificial Intelligence (Ai) Biomedical Cryogenic Data Converters Imager Integrated Circuit Design Power Management Radio Frequency (Rf) Circuits Sensor
URLView the original
Indexed ByESCI
WOS Research AreaPhysics
WOS SubjectPhysics, Condensed Matter
WOS IDWOS:000828344400001
Scopus ID2-s2.0-85135246602
Fulltext Access
Citation statistics
Cited Times [WOS]:2   [WOS Record]     [Related Records in WOS]
Document TypeJournal article
CollectionFaculty of Science and Technology
Corresponding AuthorLu, Yan
Affiliation1.University of Macau, 999078, Macao
2.University of Science and Technology of China, Hefei, 230026, China
3.Tsinghua University, Beijing, 100084, China
4.Institute of Semiconductors, Chinese Academy of Sciences, Beijing, 100083, China
5.Xi'an Jiaotong University, Xi'an, 710049, China
6.Chinese University of Hong Kong, Shenzhen, 518172, China
7.Tianjin University, Tianjin, 300072, China
First Author AffilicationUniversity of Macau
Corresponding Author AffilicationUniversity of Macau
Recommended Citation
GB/T 7714
Chan, Chi Hang,Cheng, Lin,Deng, Wei,et al. Trending IC design directions in 2022[J]. Journal of Semiconductors,2022,43(7).
APA Chan, Chi Hang.,Cheng, Lin.,Deng, Wei.,Feng, Peng.,Geng, Li.,Huang, Mo.,Jia, Haikun.,Jie, Lu.,Lei, Ka Meng.,Liu, Xihao.,Liu, Xun.,Liu, Yongpan.,Lu, Yan.,Nie, Kaiming.,Pan, Dongfang.,Qi, Nan.,Sin, Sai Weng.,Sun, Nan.,Sun, Wenyu.,...&Zhang, Zhao.(2022).Trending IC design directions in 2022.Journal of Semiconductors,43(7).
MLA Chan, Chi Hang,et al."Trending IC design directions in 2022".Journal of Semiconductors 43.7(2022).
Files in This Item:
There are no files associated with this item.
Related Services
Recommend this item
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[Chan, Chi Hang]'s Articles
[Cheng, Lin]'s Articles
[Deng, Wei]'s Articles
Baidu academic
Similar articles in Baidu academic
[Chan, Chi Hang]'s Articles
[Cheng, Lin]'s Articles
[Deng, Wei]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Chan, Chi Hang]'s Articles
[Cheng, Lin]'s Articles
[Deng, Wei]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.